MIC24052 datasheet(6/34 Pages) MICROCHIP

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MIC24052

DS20005659A-page 6

 2016 Microchip Technology Inc.

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Operating Temperature

Range

–40

—

+125

°C

Note 1

Maximum Junction Temperature

—

+150

°C

—

Storage Temperature

–65

—

+150

°C

—

Lead Temperature

—

+260

°C

Soldering, 10s

Package Thermal Resistances

Thermal Resistance, 5x6 QFN-28

JA

—28

—

°C/W

Note 2

Thermal Resistance, 5x6 QFN-28

JC

—2.5

—

°C/W

—

Note 1:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

PD(MAX) = (TJ(MAX) – TA)/JA, where JA depends upon the printed circuit layout. A 5 square inch 4 layer,

0.62”, FR-4 PCB with 2 oz. finish copper weight per layer is used for the

JA.

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