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SLVDA28 Datasheet(PDF) 4 Page - Semtech Corporation |
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SLVDA28 Datasheet(HTML) 4 Page - Semtech Corporation |
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4 / 6 page ![]() 4 ã 2000 Semtech Corp. www.semtech.com PROTECTION PRODUCTS PROTECTION PRODUCTS SLVDA2.8 I/O Line Protection Typical Connection Device Connection for Protection of Four Data Lines The SLVDA series devices are designed to protect up to four data lines. The devices are connected as follows: l Common mode protection of four data lines is achieved by connecting data lines at pins 1 - 4. Pins 5 - 8 are connected to ground (Device is symmetrical so connections may be reversed to serve a specific application). The ground connec- tions should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. l Protecting 5V lines: The designer may take advan- tage of the superior reverse leakage and capaci- tance characteristics of the SLVDA2.8 to protect two 5V lines. This is achieved by connecting two lines of the device in series as shown. The series connection is made by shorting pins 5 & 6 together for the first line and pins 7 & 8 for the second line. Pins 1 & 4 are connected to the lines that are to be protected. Pins 2 & 3 are connected to ground. See application note SI96-14 for additional details. Circuit Board Layout Recommendations for Suppres- sion of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: l Place the TVS near the input terminals or connec- tors to restrict transient coupling. l Minimize the path length between the TVS and the protected line. l Minimize all conductive loops including power and ground loops. l The ESD transient return path to ground should be kept as short as possible. l Never run critical signals near board edges. l Use ground planes whenever possible. Optional Connection for Protecting 5V Lines LINE 2 LINE 3 LINE 4 LINE 1 1 2 3 45 6 7 8 Ground From Connector To Protected Device Applications Information |
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