6

IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (Option 060)

HCPL-772X

HCPL-072X

Description

Symbol

Option 060

Option 060

Units

Installation classification per DIN VDE 0110/1.89, Table 1

for rated mains voltage

≤150 V rms

I-IV

I-IV

for rated mains voltage

≤300 V rms

I-IV

I-III

for rated mains voltage

≤450 V rms

I-III

Climatic Classification

55/85/21

55/85/21

Pollution Degree (DIN VDE 0110/1.89)

2

2

Maximum Working Insulation Voltage

630

560

V peak

Input to Output Test Voltage, Method b†

1181

1050

V peak

Input to Output Test Voltage, Method a†

945

840

V peak

Highest Allowable Overvoltage†

6000

4000

V peak

Safety Limiting Values

(Maximum values allowed in the event of a failure,

also see Thermal Derating curve, Figure 11.)

Case Temperature

175

150

°C

Input Current

230

150

mA

Output Power

600

600

mW

Ω

† Refer to the front of the optocoupler section of the Isolation and Control Component Designer’s Catalog, under Product Safety Regulations section

IEC/EN/DIN EN 60747-5-2, for a detailed description.

Note: These optocouplers are suitable for “safe electrical isolation” only within the safety limit data. Maintenance of the safety data shall be ensured

by means of protective circuits.

Note: The surface mount classification is Class A in accordance with CECC 00802.

Recommended Operating Conditions

Parameter

Symbol

Min.

Max.

Units

Figure

Ambient Operating Temperature

–40

+85

°C

Supply Voltages

4.5

5.5

V

Logic High Input Voltage

2.0

V

1, 2

Logic Low Input Voltage

0.0

0.8

V

Input Signal Rise and Fall Times

1.0

ms

Absolute Maximum Ratings

Parameter

Symbol

Min.

Max.

Units

Figure

Storage Temperature

–55

125

°C

–40

+85

°C

Supply Voltages

0

6.0

Volts

Input Voltage

–0.5

Volts

Output Voltage

–0.5

Volts

Average Output Current

10

mA

Lead Solder Temperature

260

°C for 10 sec., 1.6 mm below seating plane

Solder Reflow Temperature Profile

See Solder Reflow Temperature Profile Section