SN74LVC2G53

SINGLEPOLE DOUBLETHROW (SPDT) ANALOG SWITCH OR

2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER

SCES324K − JULY 2001 − REVISED SEPTEMBER 2003

1

POST OFFICE BOX 655303

NanoStar

 and NanoFree Packages

JESD 78, Class II

− 2000-V Human-Body Model (A114-A)

− 200-V Machine Model (A115-A)

− 1000-V Charged-Device Model (C101)

description/ordering information

The SN74LVC2G53 can handle both analog and digital signals. The device permits signals with amplitudes of

up to 5.5 V (peak) to be transmitted in either direction.

NanoStar

 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for

analog-to-digital and digital-to-analog conversion systems.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

NanoStar

 − WCSP (DSBGA)

0.17-mm Small Bump − YEA

SN74LVC2G53YEAR

NanoFree

 − WCSP (DSBGA)

0.17-mm Small Bump − YZA (Pb-free)

Reel of 3000

SN74LVC2G53YZAR

_ _ _C4_

−40

°C to 85°C

NanoStar

 − WCSP (DSBGA)

0.23-mm Large Bump − YEP

Reel of 3000

SN74LVC2G53YEPR

_ _ _C4_

−40

°C to 85°C

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

SN74LVC2G53YZPR

SSOP − DCT

Reel of 3000

SN74LVC2G53DCTR

C53_ _ _

VSSOP − DCU

Reel of 3000

SN74LVC2G53DCUR

C53_

VSSOP − DCU

Reel of 250

SN74LVC2G53DCUT

C53_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,

and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition

(1 = SnPb,

Copyright

 2003, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

DCT OR DCU PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

COM

INH

GND

GND

Y1

Y2

A

4

3

2

1

5

6

7

8

GND

GND

INH

COM

A

Y2

Y1

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

NanoStar and NanoFree are trademarks of Texas Instruments.