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THCV231 Datasheet(PDF) 53 Page - THine Electronics, Inc. |
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THCV231 Datasheet(HTML) 53 Page - THine Electronics, Inc. |
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53 / 56 page ![]() THCV231_THCV236_Rev.2.30_E Copyright©2016 THine Electronics, Inc. THine Electronics, Inc. 53/56 Security E PCB Layout Guideline regarding VDD and AVDD for THCV236 When power is supplied from reverse side layer to AVDD, please place ferrite bead between through-hole and AVDD/VDD pins (Good Example1, 2). If it is needed to set ferrite beads on reverse side, please set GND-through-hole between AVDD and VDD, and separate the distance as possible (Example). Don’t set through-holes next to each other between ferrite beads and AVDD/VDD pins (Bad Example). Good Example 1 Good Example 2 41 40 Bottom Layer 39 42 3.6V-1.7V ferrite bead bypass capasitor Through-hole Close to power pin as possible 41 40 Bo tt om La yer 39 42 3.6V-1.7V Example Bad Example 41 40 Bo tt om La yer 39 42 3.6V-1.7V Isola te thr ough - holes as possible 41 40 Bo tt om La yer 39 42 3.6 V -1. 7V D o n ’ t set t hrough-holes next t o ea ch ot her betw een fer rit e bea ds a nd AVDD/VDD pins . |
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