SNC70-HXP-AD (Preliminary)

Form-In-Place

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EMI-DS-SNC70-HXP-AD 052815

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SNC70-HXP-AD FORM-IN-PLACE DESCRIPTION

A heat cure, nickel/graphite filled silicone elastomer Form-In-Place gasket material.

Laird introduces another product in the EMI Sentry family. SNC70HXP-AD is a Nickel/

Graphite filled silicone paste with very low density and high flow ability. It also has good

shielding performance with balanced mechanical properties. With its fast curing speed, this

paste provides a very cost effective FIP solution.

Laird’s Form-In-Place is an automated system for dispensing conductive elastomer EMI

shielding and grounding gaskets onto metal or plastic substrates. This product is particularly

ideal for base stations, PDAs, PC cards, radios, mobile phones, as well as many other cast or

plastic enclosures and packaged electronic assemblies.

TYPICAL VALUES

CATEGORIES

TEST METHOD

UNITS

SNC70-HXP-AD

Elastomer

Silicone

Filler type

Nickel / Graphite

ELECTRICAL PROPERTIES

Volume Resistivity

ohm-cm

0.030

Shielding Effectiveness

MIL-DTL-83528C

200 MHz to 10 GHz

Para. 4.5.12

dB

>90

PHYSICAL PROPERTIES

Hardness

ASTM D2240

Shore A

65

Density (cured)

ASTM D792

g/cm

3

1.9

Density (uncured)

LT-FIP-CLE-09

g/cm

3

1.6

Compression Set

ASTM D395

%

15

Adhesion Strength (Al)

LT-FIP-CLE-03

>180

Compression-Deflection (a)

LT-FIP-CLE-07

at 20% compression

lb/in

2.8

at 40% compression

lb/in

10.2

Temperature Range

°C

-50°C to 125°C

UL Flammability Rating

UL94(between Al)

V0 (Pending)

CURING REQUIREMENTS

Cure Conditions

120°C minimum

Curing time at 125°C

LT-FIP-CLE-14

1hour

(a) Compression-deflection bead size 0.62mm (H) × 0.70mm (W)

(b) Time to effectively cure a bead will necessarily depend on individual conditions, including but not limited to bead size, shield size and

weight, oven capacity, and oven ramp-rates.