ISP1102BS datasheet(4/23 Pages) PHILIPS

4 / 23 page

Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 — 02 September 2003

4 of 23

9397 750 11228

[1]

Symbol names with an overscore (e.g. OE) indicate active LOW signals.

n.c.

not connected

VCC(I/O)

supply voltage for digital I/O pins (1.65 to 3.6 V). When VCC(I/O) is not

connected, the D+ and D

− pins are in three-state. This supply pin is totally

independent of VCC(5.0) and Vreg(3.3) and must never exceed the Vreg(3.3)

voltage.

VBUSDET

VBUS indicator output (CMOS level with respect to VCC(I/O)); when

VBUS > 4.1 V, then VBUSDET = HIGH and when VBUS < 3.6 V, then

VBUSDET = LOW; when SUSPND = HIGH, then pin VBUSDET is pulled

HIGH

output pad; push pull; 4 mA output drive; CMOS

−

AI/O

negative USB data bus connection (analog, differential)

D+

AI/O

positive USB data bus connection (analog, differential)

n.c.

not connected

n.c.

not connected

n.c.

not connected

Vreg(3.3)

internal regulator option: regulated supply voltage output (3.0 to 3.6 V)

during 5 V operation; a decoupling capacitor of at least 0.1

µF is required

regulator bypass option: used as a supply voltage input (3.3 V

±10%)

for 3.3 V operation

VCC(5.0)

internal regulator option: supply voltage input (4.0 to 5.5 V); can be

connected directly to USB line VBUS

regulator bypass option: connect to Vreg(3.3)

Vpu(3.3)

pull-up supply voltage (3.3 V

±10%); connect an external 1.5 kΩ resistor

on D+ (full-speed).

Pin function is controlled by input SOFTCON:

SOFTCON = LOW — Vpu(3.3) ﬂoating (high impedance); ensures zero

pull-up current

SOFTCON = HIGH — Vpu(3.3) = 3.3 V; internally connected to Vreg(3.3)

SOFTCON

software controlled USB connection input; a HIGH level applies 3.3 V to

pin Vpu(3.3), which is connected to an external 1.5 kΩ pull-up resistor; this

allows USB connect or disconnect signalling to be controlled by software

input pad; push pull; CMOS

GND

exposed

die pad

exposed

die pad

ground supply; down bonded to the exposed die pad (heatsink); to be

connected to the PCB ground

Table 2:

Pin description…continued

Symbol[1]

Type

Description

HBCC16

HVQFN14

ISP1102BS Datasheet(PDF) 4 Page - NXP Semiconductors

ISP1102BS Datasheet(HTML) 4 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

Datasheet Download

Link URL