Philips Semiconductors

ISP1102

Advanced USB transceiver

Product data

Rev. 03 — 02 September 2003

21 of 23

9397 750 11228

© Koninklijke Philips Electronics N.V. 2003. All rights reserved.

[5]

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it

is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8]

Hot bar soldering or manual soldering is suitable for PMFP packages.

17. Revision history

Table 17:

Revision history

Rev Date

CPCN

Description

03

20030902

-

Product data (9397 750 11228)

Modifications:

• Section 2: updated

• Section 7.3: updated the first line under Normal mode

• Table 6: added a table note

• Section 8.1: updated the first paragraph and added a note

02

20030106

-

Product data (9397 750 10397)

01

20000524

-

Objective data