TLK1521 datasheet(14/19 Pages) TI

14 / 19 page

TLK1521

500 Mbps to 1.3 Gbps TRANSCEIVER

SLLS591A− OCTOBER 2003 − REVISED JANUARY 2004

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

DOUTXN

DOUTXP

50%

80%

20%

80%

50%

20%

+ V

−V

0 V

80%

20%

DOUTXP

DOUTXN

Figure 9. Rise and Fall Time Definitions

thermal characteristics

PARAMETER

TEST CONDITION

MIN

TYP

MAX

UNIT

RθJA

Junction-to-free-air thermal resistance

Board mounted, no air flow, high conductivity TI

recommended test board, chip soldered or greased to

21.47

°C/W

RθJC

Junction-to-case thermal resistance

recommended test board, chip soldered or greased to

thermal land

0.38

°C/W

RθJA

Junction-to-free-air thermal resistance

Board mounted, no air flow, high conductivity TI

recommended test board with thermal land but no

42.2

°C/W

RθJC

Junction-to-case thermal resistance

recommended test board with thermal land but no

solder or grease thermal connection to thermal land

0.38

°C/W

RθJA

Junction-to-free-air thermal resistance

Board mounted, no air flow, JEDEC test board

75.83

°C/W

RθJC

Junction-to-case thermal resistance

Board mounted, no air flow, JEDEC test board

7.8

°C/W

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