MP34DT05

Package information

DocID029902 Rev 1

17/21

9

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

9.1

Soldering information

The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards

and is qualified for soldering heat resistance according to JEDEC J-STD-020.

Land pattern and soldering recommendations are available at www.st.com.

Figure 10: Recommended soldering profile limits

Table 8: Recommended soldering profile limits

Description

Parameter

Pb free

Average ramp rate

3 °C/sec max

Preheat

Minimum temperature

Maximum temperature

150 °C

200 °C

60 sec to 120 sec

Ramp-up rate

Time maintained above liquids temperature

Liquids temperature

60 sec to 150 sec

217 °C

Peak temperature

260 °C max

Time within 5 °C of actual peak temperature

20 sec to 40 sec

Ramp-down rate

6 °C/sec max

Time 25 °C (t25 °C) to peak temperature

8 minutes max

RAMP-DOWN

RAMP-UP

t

s

PREHEAT

t

L

t

p

T

T

SMAX

T

SMIN

T

P

T

L

30 60 90

120 150 180

210

240

270

300

330

360 390

T25° to PEAK

CRITICAL ZONE

TIME