STM32F410RB datasheet(120/142 Pages) STMICROELECTRONICS

120 / 142 page

Package information

STM32F410x8/B

120/142

DocID028094 Rev 5

Figure 42. WLCSP36 - 36-pin, 2.553 x 2.579 mm, 0.4 mm pitch wafer level chip scale

package recommended footprint

Table 79. WLCSP36 - 36-pin, 2.553 x 2.579 mm, 0.4 mm pitch wafer level chip scale

package mechanical data

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Min

Typ

Max

Min

Typ

Max

0.525

0.555

0.585

0.0207

0.0219

0.0230

0.170

0.0069

0.380

0.0150

A3(2)

2. Back side coating.

0.025

0.0010

b(3)

3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

0.220

0.250

0.280

0.0087

0.0098

0.0110

2.518

2.553

2.588

0.1012

0.1026

0.1039

2.544

2.579

2.614

0.1050

0.1064

0.1078

0.400

0.0157

2.000

0.0787

2.000

0.0787

0.2765

0.0119

0.2895

0.0138

aaa

0.100

0.0039

bbb

0.100

0.0039

ccc

0.100

0.0039

ddd

0.050

0.0020

eee

0.050

0.0020

STM32F410RB Datasheet(PDF) 120 Page - STMicroelectronics

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