Package information

EMIF06-HSD03F3

8/10

DocID025248 Rev 4

Figure 15. Tape and reel specification

Note:

More information is available in the application notes:

AN2348, “IPAD™ 400 µm Flip Chip: package description and recommendations for use”

AN1751, “EMI filters: recommendations and measurements”

AN4541: “EMI Filters for SD3.0 card: High speed SD card protection and filtering devices”

Figure 13. Footprint recommendations

Figure 14. Marking

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:

300 µm minimum

x

y

x

w

z

w

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

ECOPACK® grade