This is information on a product in full production.

October 2016

DocID025248 Rev 4

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EMIF06-HSD03F3

EMI filter with integrated ESD protection for micro-SD Card™

Datasheet

Figure 1. Pin configuration (bump side)

Figure 2. Functional schematic

Features

 Very low line capacitance to compensate long

PCB tracks (2.5 pF typ.)

 High efficiency in ESD suppression up to 18 kV

(IEC 61000-4-2)

 Very low PCB space consumption:

– 1.1 x 2.4 mm

 Ultralow leakage current: 20 nA max.

 Very thin package: 0.605 mm

 Smart pinout for easier PCB layout

 High reduction of parasitic elements through

integration and wafer level packaging

 Lead-free package

 Complies with the following standards:

– IEC 61000-4-2 level 4:±15 kV (air

discharge), ±8 kV (contact discharge)

Application

 SD3.0, UHS-1 SDR104 (208 MHz)

Description

The EMIF06-HSD03F3 chip is a highly integrated

device designed to suppress EMI/RFI noise for

interface line filtering.

The EMIF06-HSD03F3 Flip-Chip packaging

means the package size is equal to the die size.

That’s why EMIF06-HSD03F3 is a very small

device. Additionally, this filter includes ESD

protection circuitry, which prevents damage to the

protected device when subjected to ESD surges

up 18 kV.

Flip- hip package

C

(

bumps)

17

Ix

Ox

R = 1

Ω

L

1 nH

=

CLINE = 2.5 pF

DET

VCC

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