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ESDALC14V2-2BP5 Datasheet(PDF) 5 Page - STMicroelectronics |
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ESDALC14V2-2BP5 Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 6 page ![]() Obsolete Product(s) - Obsolete Product(s) ESDALC14V2-2BP5 / ESDALC25-2BP5 4 Ordering information 5/6 Figure 7. Footprint dimensions In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 4 Ordering information 5 Revision history Part Number Marking Package Weight Base qty Delivery mode ESDALC14V2-2BP5 A3 SOT665 2.9 mg 3000 Tape & reel ESDALC25-2BP5 A4 Date Revision Changes 08-Dec-2005 1 First issue 0.5 0.3 dimensions in mm Obsolete Product(s) - Obsolete Product(s) |
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