Recommendation on PCB assembly

ESDARF02-1BU2

6/9

DocID026231 Rev 2

3

Recommendation on PCB assembly

3.1

Stencil opening design

Figure 12. Recommended stencil windows position

3.2

Solder paste

1.

Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

2.

“No clean” solder paste is recommended.

3.

Offers a high tack force to resist component movement during high speed

4.

Solder paste with fine particles: powder particle size is 20-45 µm.

0.230

(0.0091)

0.183

(0.0072)

0.170

(0.0067)

0.656

(0.0258)

0.643

(0.0253)

Footprint

Stencil window

0.007

(0.00027)

0.007

(0.00027)

mm

(inches)

0.243

(0.0096)