SSM2603 datasheet(32/33 Pages) AD

32 / 33 page

Data Sheet

SSM2603

Rev. C | Page 31 of 32

OUTLINE DIMENSIONS

Figure 32. 28-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 x 5 mm Body, Very Very Thin Quad

(CP-28-6)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

SSM2603CPZ-REEL

−40°C to +85°C

28-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-28-6

SSM2603CPZ-REEL7

−40°C to +85°C

28-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-28-6

SSM2603-EVALZ

Evaluation Board

Z = RoHS Compliant Part.

0.50

BSC

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

3.40

3.30 SQ

3.20

0.50

0.40

0.30

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

PIN 1

INDICATOR

0.30

0.25

0.18

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COMPLIANT

TO JEDEC STANDARDS MO-220-WHHD-3.

5.10

5.00 SQ

4.90

0.20 MIN

SSM2603 Datasheet(PDF) 32 Page - Analog Devices

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