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LDW5SM Datasheet(PDF) 12 Page - OSRAM GmbH |
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LDW5SM Datasheet(HTML) 12 Page - OSRAM GmbH |
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12 / 21 page  2017-06-06 12 Version 1.3 LD W5SM Recommended Solder Pad 7) page 20 Reflow soldering Empfohlenes Lötpaddesign 7) Seite 20 Reflow-Löten Note: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Anm.: Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für Ultraschallreinigung nicht geeignet. Solder resist Freies Kupfer Bare Copper Lötpasten Schablone Solder paste stencil Lötstopplack OHAY0681 Kupfer Copper 1.6 (0.063) 11.6 (0.457) 12.0 (0.472) 1.6 (0.063) 11.6 (0.457) 3 Lötstellen 3 solder points Thermal enhanced PCB Thermisch optimiertes PCB ø4.0 (0.157) Heatsink attach ø4.0 (0.157) ø2.5 (0.098) |
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