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PixArt Imaging Inc.

PAC7640 Product Datasheet

Enhanced QE Global Shutter Image Sensor

Version 1.1 | 11 Sep 2015 | 41002EN

PixArt Imaging Inc. http://www.pixart.com

All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission.

4.4

Packing Information

4.4.1

Chip Orientation

The chips are packed into 2-inch chip-tray with Pin 1 (A1 pin) orientation is toward the chamfer of chip tray. Refer to Figure

7. IC Orientation.

Figure 7. IC Orientation

4.4.2

Packing Capacity

Table 10. Packing Information

Parameters

Quantity

Unit

Notes

Chips per Tray

81

piece

9 x 9. Refer to Figure 7.

Trays per Stack

10

tray

Plus a top-cover on top of each stack. Refer to Figure 8

Stacks per Packing Bag

2

stacks

Packaging bag is Aluminum laminated moisture proof bag.

Refer to Figure 9

Packing Bags per Packing Box

5

bag

Refer to Figure 10

Max. Chips per Packing Box

8100

piece

Figure 8. Example of One Stack (10 Chip-Trays + 1 Cover-Tray)