5.4 Thermal Information

THERMAL METRIC(1)

SNx4ACT244

UNIT

DB

(SSOP)

DGS

(VSSOP)

DW

(SOIC)

N

(PDIP)

NS

(SO)

PW

(TSSOP)

RKS

(VQFN)

20 PINS

20 PINS

20 PINS

20 PINS

20 PINS

20 PINS

20 PINS

RθJA

Junction-to-ambient thermal

resistance

117.2

123.5

101.2

48.1

106.2

126.2

67.7

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

76.9

62.1

68.2

34.1

72

68.7

72.4

°C/W

RθJB

Junction-to-board thermal

resistance

72.1

78.5

69.7

29

71.2

77.3

40.4

°C/W

ψJT

Junction-to-top

characterization parameter

43.1

7.8

44.1

19.5

42.4

22.3

10.3

°C/W

ψJB

Junction-to-board

characterization parameter

71.7

78.0

69.2

28.9

70.9

76.9

40.4

°C/W

RθJC(bot)

Junction-to-case (bottom)

thermal resistance

N/A

N/A

N/A

N/A

N/A

N/A

24.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

MIN

TYP

MAX

UNIT

VOH

IOH = –50 µA

TA = 25°C

4.5 V

4.4

4.49

V

SN54ACT244

4.4

SN74ACT244

4.4

TA = 25°C

5.5 V

5.4

5.49

SN54ACT244

5.4

SN74ACT244

5.4

IOH = –24 mA

TA = 25°C

4.5 V

3.86

SN54ACT244

3.7

SN74ACT244

3.76

TA = 25°C

5.5 V

4.86

SN54ACT244

4.7

SN74ACT244

4.76

IOH = –50 mA(1)

SN54ACT244

5.5 V

3.85

IOH = –75 mA(1)

SN74ACT244

5.5 V

3.85

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SN54ACT244, SN74ACT244

SCAS517G – JUNE 1995 – REVISED MARCH 2024

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