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DLP650LE

DLPS095 – NOVEMBER 2017

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Copyright © 2017, Texas Instruments Incorporated

Recommended Operating Conditions (continued)

Over operating free-air temperature range (unless otherwise noted).

(1)

MIN NOM

MAX

UNIT

(8)

See LVDS Timing Requirements in Timing Requirements and Figure 6.

(9)

See Figure 5 LVDS Waveform Requirements.

(10) Simultaneous exposure of the DMD to the maximum Recommended Operating Conditions for temperature and UV illumination will

reduce device lifetime.

(11) The array temperature cannot be measured directly and must be computed analytically from the temperature measured at test point 1

(TP1) shown in Figure 10 and the package thermal resistance using the Micromirror Array Temperature Calculation.

(12) Long-term is defined as the usable life of the device.

(13) Per Figure 1, the maximum operational array temperature should be derated based on the micromirror landed duty cycle that the DMD

experiences in the end application. See Micromirror Landed-On/Landed-Off Duty Cycle for a definition of micromirror landed duty cycle.

(14) Array temperatures beyond those specified as long-term are recommended for short-term conditions only (power-up). Short-term is

defined as cumulative time over the usable life of the device and is less than 500 hours.

(15) The locations of thermal test points TP2, TP3, TP4, and TP5 in Figure 10 are intended to measure the highest window edge

temperature. For most applications, the locations shown are representative of the highest window edge temperature. If a particular

application causes additional points on the window edge to be at a higher temperature, test points should be added to those locations.

(16) The maximum marginal ray angle of the incoming illumination light at any point in the micromirror array, including Pond of Micromirrors

(POM), should not exceed 55 degrees from the normal to the device array plane. The device window aperture has not necessarily been

designed to allow incoming light at higher maximum angles to pass to the micromirrors, and the device performance has not been tested

nor qualified at angles exceeding this. Illumination light exceeding this angle outside the micromirror array (including POM) will

contribute to thermal limitations described in this document, and may negatively affect lifetime.

(17) Temperature delta is the highest difference between the ceramic test point 1 (TP1) and anywhere on the window edge as shown in

Figure 10. The window test points TP2, TP3, TP4, and TP5 shown in Figure 10 are intended to result in the worst case delta

temperature. If a particular application causes another point on the window edge to result in a larger delta temperature, that point should

be used.

(18) The average over time (including storage and operating) that the device is not in the ‘elevated dew point temperature range'.

(19) Exposure to dew point temperatures in the elevated range during storage and operation should be limited to less than a total

Time required for SCP output buffer to recover after SCPENZ

(from tri-state).

s

SCPENZ inactive pulse width (high level)

1

200

ns

200

ns

LVDS INTERFACE

320

330

MHz

100

400

600

mV

1200

mV

0

2000

mV

Time required for LVDS receivers to recover from PWRDNZ

10

ns

Internal differential termination resistance

95

105

Ω

Line differential impedance (PWB/trace)

85

90

95

Ω

ENVIRONMENTAL

10

°C

0

10

°C

Window temperature (all part numbers except *1280-6434B)

(15) (16)

10

90

°C

10

85

Absolute temperature delta between any point on the window

26

°C

28

°C

28

36

°C

Cumulative time in elevated dew point temperature range

24

Months

0.68

2.00

Illumination Wavelengths between 395 nm and 800 nm

Thermally limited

Illumination Wavelengths > 800 nm

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