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AD9670EBZ Datasheet(PDF) 12 Page - Analog Devices

Part # AD9670EBZ
Description  Octal Ultrasound Analog Front End
PDF  48 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD9670EBZ Datasheet(HTML) 12 Page - Analog Devices

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Data Sheet
AD9674
Rev. A | Page 11 of 47
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
AVDD1 to GND
−0.3 V to +2.0 V
AVDD2 to GND
−0.3 V to +3.9 V
DVDD to GND
−0.3 V to +2.0 V
DRVDD to GND
−0.3 V to +2.0 V
GND to GND
−0.3 V to +0.3 V
AVDD2 to AVDD1
−2.0 V to +3.9 V
AVDD1 to DRVDD
−2.0 V to +2.0 V
AVDD2 to DRVDD
−2.0 V to +3.9 V
Digital Outputs (DOUTx+, DOUTx−,
DCO+, DCO−, FCO+, FCO−) to GND
−0.3 V to DRVDD + 0.3 V
LI-x, LG-x, LO-x, LOSW-x, CWI−, CWI+,
CWQ−, CWQ+, GAIN+, GAIN−,
RESET+, RESET−, MLO+, MLO−,
GPO0, GPO1, GPO2, GPO3 to GND
−0.3 V to AVDD2 + 0.3 V
CLK+, CLK−, TX_TRIG+, TX_TRIG−,
VREF to GND
−0.3 V to AVDD1 + 0.3 V
SDIO, PDWN, STBY, SCLK, CSB, ADDRx
−0.3 V to DRVDD + 0.3 V
Operating Temperature Range
(Ambient)
0°C to 85°C
Storage Temperature Range
(Ambient)
−65°C to +150°C
Maximum Junction Temperature
150°C
Lead Temperature (Soldering, 10 sec)
300°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL IMPEDANCE
Table 5.
Symbol
Description
Value1
Unit
θJA
Junction to ambient thermal
resistance, 0.0 m/sec airflow per
JEDEC JESD51-2 (still air)
22.0
°C/W
ΨJB
Junction to board thermal
characterization parameter, 0 m/sec
airflow per JEDEC JESD51-8 (still air)
9.2
°C/W
ΨJT
Junction to top of package
characterization parameter, 0 m/sec
airflow per JEDEC JESD51-2 (still air)
0.12
°C/W
1
Results are from simulations. The printed circuit board (PCB) is JEDEC
multilayer. Thermal performance for actual applications requires careful
inspection of the conditions in the application to determine whether they
are similar to those assumed in these calculations.
ESD CAUTION



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