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LTC6902 Datasheet(PDF) 15 Page - Linear Technology |
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LTC6902 Datasheet(HTML) 15 Page - Linear Technology |
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15 / 28 page ![]() LTM4632 15 4632fc For more information www.linear.com/LTM4632 APPLICATIONS INFORMATION Power Good The PGOOD pins are open drain pins that can be used to monitor valid output voltage regulation. This pin monitors a ±8% window around the regulation point. A resistor can be pulled up to a particular supply voltage for monitoring. To prevent unwanted PGOOD glitches during transients or dynamic VOUT changes, the LTM4632’s PGOOD falling edge includes a blanking delay of approximately 40μs. Stability Compensation The LTM4632 module internal compensation loop is de-signed and optimized for low ESR ceramic output capacitors only application. Table 5 is provided for most application requirements. The LTpowerCAD Design Tool is available to download for control loop analysis for further optimization. RUN Enable Pulling the RUN pin to ground forces the LTM4632 into its shutdown state, turning off both power MOSFETs and most of its internal control circuitry. Tying the RUN pin voltage above 1.28V will turn on the entire chip. Low Input Application The LTM4632 is capable to run from 3.3V input when the VIN pin is tied to INTVCC pin. See Figure 21 for the application circuit. Please note the INTVCC pin has 3.6V ABS max voltage rating. Pre-Biased Output Start-Up (Channel 1) There may be situations that require the power supply to start up with a pre-bias on the output capacitors. In this case, it is desirable to start up without discharging that output pre-bias. The LTM4632 channel 1 can safely power up into a pre-biased output without discharging it. The LTM4632 accomplishes this by forcing discontinuous mode (DCM) operation until the TRACK/SS1 pin voltage reaches 80% of the 0.6V reference voltage for channel 1. This will prevent the BG from turning on during the pre- biased output start-up which would discharge the out- put. Do not pre-bias LTM4632 with a voltage higher than INTVCC (3.3V) voltage. Overtemperature Protection The internal overtemperature protection monitors the junction temperature of the module. If the junction temperature reaches approximately 170°C, both power switches will be turned off until the temperature drops about 10°C cooler. Input Overvoltage Protection In order to protect the internal power MOSFET devices against transient voltage spikes, the LTM4632 constantly monitors each VIN pin for an overvoltage condition. When VIN rises above 17.5V, the regulator suspends operation by shutting off both power MOSFETs on the correspond- ing channel. Once VIN drops below 16.5V, the regulator immediately resumes normal operation. The regulator executes its soft-start function when exiting an overvolt- age condition. Thermal Considerations and Output Current Derating The thermal resistances reported in the Pin Configuration section of the data sheet are consistent with those param- eters defined by JESD51-9 and are intended for use with finite element analysis (FEA) software modeling tools that leverage the outcome of thermal modeling, simulation, and correlation to hardware evaluation per-formed on a µModule package mounted to a hardware test board— also defined by JESD51-9 (“Test Boards for Area Array Surface Mount Package Thermal Measurements”). The motivation for providing these thermal coefficients in found in JESD51-12 (“Guidelines for Reporting and Using Electronic Package Thermal Information”). Many designers may opt to use laboratory equipment and a test vehicle such as the demo board to anticipate the µModule regulator’s thermal performance in their appli- cation at various electrical and environmental operating conditions to compliment any FEA activities. Without FEA software, the thermal resistances reported in the Pin Configuration section are in-and-of themselves not relevant to providing guidance of thermal performance; instead, the derating curves provided in the data sheet can be used in a manner that yields insight and guidance per- taining to one’s application-usage, and can be adapted to correlate thermal performance to one’s own application. |
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