HMC903LP3E

Data Sheet

Rev. H | Page 4 of 13

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Drain Bias Voltage

4.5 V

RF Input Power

20 dBm

Gate Bias Voltage

−2 V to +0.2 V

−2 V to +0.2 V

85°C, Derate 6.9 mW/°C Above 85°C)

0.45 W

Channel Temperature

150°C

Maximum Peak Reflow Temperature

260°C

Storage Temperature

−65°C to +85°C

Operating Temperature

−40°C to +85°C

ESD Sensitivity (Human Body Model)

Class 0, Passed 150 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 4. Thermal Resistance

Unit

HCP-16-1

144.8

°C/W

1

Thermal impedance simulated values are based on JEDEC 2s2p thermal test

board. See JEDEC JESD51.

ESD CAUTION