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HIP2121 Datasheet(PDF) 11 Page - Renesas Technology Corp |
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HIP2121 Datasheet(HTML) 11 Page - Renesas Technology Corp |
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11 / 16 page ![]() HIP2120, HIP2121 FN7668 Rev 0.00 Page 11 of 16 December 23, 2011 Functional Description Functional Overview When connected to a half bridge, the output of the bridge on the HS node follows the PWM input. In other words, when the PWM input is high, the high-side bridge FET is turned on and the low-side FET is off. When the PWM input is low, the low-side bridge FET is turned on and the high-side is turned off. The enable pin (EN), when low, drives both outputs to a low state. When the PWM input transitions high or low, it is necessary to insure that both bridge FETS are not on at the same time to prevent shoot-through currents (break before make). The internal programmable timers delay the rising edge of either output resulting with both outputs being off before either of the bridge FETs is driven on. An 8k resistor connected between RDT and VSS results in a nominal dead time of 220ns. An 80k results with a minimum nominal dead time of 25ns. Resistors values less than 8k and greater than 80k are not recommended. The high-side driver bias is established by the boot capacitor connected between HB and HS. The charge on the boot capacitor is provided by the internal boot diode that is connected to VDD. The current path to charge the boot capacitor occurs when the low-side bridge FET is on. This charge current is limited in amplitude by the inherent resistance of the boot diode and by the drain-source voltage of the low-side FET. Assuming that the on time of the low-side FET is sufficiently long to fully charge the boot capacitor, the boot voltage will charge very close to VDD (less the boot diode drop and the low-side FET on voltage). When the PWM input transitions high, the high-side bridge FET is driven on after the dead time. Because the HS node is connected to the source of the high-side FET, the HS node will rise almost to the level of the bridge voltage (less the conduction voltage across the bridge FET). Because the boot capacitor voltage is referenced to the source voltage of the high-side FET, the HB node is VDD volts above the HS node and the boot diode is reversed biased. Because the high-side driver circuit is referenced to the HS node, the HO output is now approximately VHB + VBRIDGE above ground. During the low to high transition of the HS node, the boot capacitor sources the necessary gate charge to fully enhance the high-side bridge FET gate. After the gate is fully charged, the boot capacitor no longer sources the charge to the gate but continues to provide bias current to the high-side driver. It is clear that the charge of the boot capacitor must be substantially larger than the required charge of the high-side FET and high-side driver otherwise the boot voltage will sag excessively. If the boot capacitor value is too small for the required maximum of on-time of the high-side FET, the high-side UV lockout may engage resulting with an unexpected operation. Application Information Selecting the Boot Capacitor Value The boot capacitor value is chosen not only to supply the internal bias current of the high-side driver but also, and more significantly, to provide the gate charge of the driven FET without causing the boot voltage to sag excessively. In practice, the boot capacitor should have a total charge that is about 20 times the gate charge of the driven power FET for approximately a 5% drop in voltage after the charge has been transferred from the boot capacitor to the gate capacitance. The following parameters are required to calculate the value of the boot capacitor for a specific amount of voltage droop. In this example, the values used are arbitrary. They should be changed to comply with the actual application. The following equations calculate the total charge required for the Period. This equation assumes that all of the parameters are constant during the period duration. The error is insignificant if the ripple is small. Qc = Qgate80V + Period x (IHB + VHO/RGS + Igate_leak) Cboot = Qc/(Ripple * VDD) Cboot = 0.52µF If the gate to source resistor is removed (RGS is usually not needed or recommended), then: Cboot = 0.33µF VDD = 10V VDD can be any value between 7 and 14VDC VHB = VDD - 0.6V = VHO High side driver bias voltage (VDD - boot diode voltage) referenced to VHS Period = 1ms This is the longest expected switching period IHB = 100µA Worst case high side driver current when xHO = high (this value is specified for VDD = 12V but the error is not significant) RGS = 100k Gate-source resistor (usually not needed) Ripple= 5% Desired ripple voltage on the boot cap (larger ripple is not recommended) Igate_leak = 100nA From the FET vendor’s datasheet Qgate80V = 64nC From Figure 21 FIGURE 21. TYPICAL GATE CHARGE OF A POWER FET 12 10 8 6 4 2 0 10 20 30 40 50 60 70 80 QG TOTAL GATE CHARGE (nC) 0 VDS = 80V VDS = 50V VDS = 20V ID = 33A |
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