FN7668 Rev 0.00

Page 14 of 16

December 23, 2011

HIP2120, HIP2121

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EPAD Design Considerations

The thermal pad of the HIP2120/21 is electrically isolated. It’s

primary function is to provide heat sinking for the IC. It is

Figure 24 is an example of how to use vias to remove heat from

the IC substrate.

Depending on the amount of power dissipated by the HIP2120/21,

it may be necessary, to connect the EPAD to one or more ground

plane layers. A via array, within the area of the EPAD, will conduct

heat from the EPAD to the gnd plane on the bottom layer. If inner

PCB layers are available, it is also be desireable to connect these

additional layers with the plated-through vias.

The number of vias and the size of the GND planes required for

adequate heatsinking is determined by the power dissipated by

the HIP2120/21, the air flow, and the maximum temperature of

the air around the IC.

It is important that the vias have a low thermal resistance for

efficient heat transfer. Do not use “thermal relief” patterns to

connect the vias.

Products

Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products

address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.

Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a

complete list of Intersil product families.

For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on

intersil.com: HIP2120, HIP2121

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FIGURE 24. PCB VIA PATTERN

EPAD

GND

PLANE

COMPONENT

LAYER

EPAD

GND

PLANE

BOTTOM

LAYER

FIGURE 24. TYPICAL PCB PATTERN FOR THERMAL VIAS

Revision History

The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you

have the latest revision.

DATE

REVISION

CHANGE

December 23, 2011

FN7668.0

Initial Release