1104LS series

Soldering condition

1. Heat stress during soldering will influence the reliability of LEDs, however that effect will vary on heating

method. Also, if components of varying shape are soldered together, it is recommended to set the soldering

pad temperature according to the component most vulnerable to heat (e.g., surface mount LED).

2. LED parts including the resin are not stable immediately after soldering ( when they are not at room

temperature), any mechanical stress may cause damage to the product. Please avoid such stress after

soldering, especially stacking of the boards which may cause the boards to warp and any other types of

friction with hard materials.

3. Recommended temperature profile for the Reflow soldering is listed as the temperature of the resin surface.

Temperature distribution varies on heating method, PCB material, other components in the assembly, and

mounting density.

Please do not repeat the heating process in Reflow process more than twice.

Note 1

Recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface.

This should be the maximum temperature for soldering. Lowering the heating temperature and decreasing

heating time is very effective in achieving higher reliability.

Note 2

The reflow soldering process should be done up to twice(2 times Max). When second process is performed,

interval between first and second process should be as short as possible to prevent absorption of moisture to

resin of LED. The second soldering process should not be done until LEDs have returned to room

temperature (by nature-cooling) after first soldering process.

【Soldering precaution】

(acc.to EIAJ-4701/300)

【Recommended reflow soldering condition】

40sec MAX.

150℃～180℃

+1.5～+5℃/s

260℃ MAX.

-1.5～-5℃/s

90~120sec MAX.

230℃ MAX.

Peak temperature

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2017.11.20