MSP430F2111IPW datasheet(27/53 Pages) TI

27 / 53 page

MSP430x21x1

MIXED SIGNAL MICROCONTROLLER

SLAS439C − SEPTEMBER 2004 − REVISED JULY 2006

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

electrical characteristics over recommended ranges of supply voltage and operating free-air

temperature (unless otherwise noted) (continued)

crystal oscillator, LFXT1, high frequency modes (see Note 5)

PARAMETER

TEST CONDITIONS

VCC

MIN

TYP

MAX

UNIT

fLFXT1,HF0

LFXT1 oscillator crystal frequency,

HF mode 0

XTS = 1, LFXT1Sx = 0

1.8 V − 3.6 V

0.4

MHz

fLFXT1,HF1

LFXT1 oscillator crystal frequency,

HF mode 1

XTS = 1, LFXT1Sx = 1

1.8 V − 3.6 V

MHz

LFXT1 oscillator crystal frequency,

1.8 V − 3.6 V

MHz

fLFXT1,HF2

LFXT1 oscillator crystal frequency,

HF mode 2

XTS = 1, LFXT1Sx = 2

2.2 V − 3.6 V

MHz

fLFXT1,HF2

HF mode 2

XTS = 1, LFXT1Sx = 2

3.0 V − 3.6 V

MHz

LFXT1 oscillator logic level square

1.8 V − 3.6 V

0.4

MHz

fLFXT1,HF,logic

LFXT1 oscillator logic level square

wave input frequency,

HF mode

XTS = 1, LFXT1Sx = 3

2.2 V − 3.6 V

0.4

MHz

fLFXT1,HF,logic wave input frequency,

HF mode

XTS = 1, LFXT1Sx = 3

3.0 V − 3.6 V

0.4

MHz

XTS = 0, LFXT1Sx = 0,

fLFXT1,HF = 1 MHz,

CL,eff = 15 pF

2700

OAHF

Oscillation Allowance for HF

crystals

(refer to Figure 14 and Figure 15)

XTS = 0, LFXT1Sx = 1

fLFXT1,HF = 4 MHz,

CL,eff = 15 pF

800

(refer to Figure 14 and Figure 15)

XTS = 0, LFXT1Sx = 2

fLFXT1,HF = 16 MHz,

CL,eff = 15 pF

300

CL,eff

Integrated effective Load

Capacitance, HF mode

(see Note 1)

XTS = 1 (see Note 2)

Duty Cycle

HF mode

XTS = 1, Measured at P1.4/ACLK,

fLFXT1,HF = 10 MHz

2.2 V/3 V

Duty Cycle

HF mode

XTS = 1, Measured at P1.4/ACLK,

fLFXT1,HF = 16 MHz

2.2 V/3 V

fFault,HF

Oscillator fault frequency, HF mode

(see Note 4)

XTS = 1, LFXT1Sx = 3

(see Notes 3)

2.2 V/3 V

300

kHz

NOTES:

1. Includes parasitic bond and package capacitance (approximately 2pF per pin).

Since the PCB adds additional capacitance it is recommended to verify the correct load by measuring the ACLK frequency. For a

correct setup the effective load capacitance should always match the specification of the used crystal.

2. Requires external capacitors at both terminals. Values are specified by crystal manufacturers.

3. Measured with logic level input frequency but also applies to operation with crystals.

4. Frequencies below the MIN specification will set the fault flag, frequencies above the MAX specification will not set the fault flag.

Frequencies in between might set the flag.

5. To improve EMI on the LFXT1 oscillator the following guidelines should be observed.

− Keep as short of a trace as possible between the device and the crystal.

− Design a good ground plane around the oscillator pins.

− Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.

− Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.

− Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.

− If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.

− Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other

documentation. This signal is no longer required for the serial programming adapter.

MSP430F2111IPW Datasheet(PDF) 27 Page - Texas Instruments

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