© 2009 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSA2000

• Rev. 1.0.0

10

Physical Dimensions

Figure 7. 16-Pin Ultrathin Molded Leadless Package (UMLP)

Order Number

Operating Temperature Range

Package Description

Packing Method

FSA2000UMX

-40 to 85°C

16-Terminal Ultrathin Molded Leadless Package (UMLP)

Tape & Reel

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without

notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most

recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty

therein, which covers Fairchild products.

A. THIS PACKAGE IS NOT CURRENTLY REGISTERED WITH

C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994

TOP VIEW

BOTTOM VIEW

RECOMMENDED LAND PATTERN

0.10 C

0.08 C

B

A

C

2.60

1.80

0.10 C

2X

2X

SIDE VIEW

SEATING

PLANE

0.10 C

0.050

0.10 C A B

0.05 C

0.55 MAX.

0.40

PIN #1 IDENT

1

5

9

13

16

ALL TERMINALS

2.100

2.900

0.400

0.663

0.563

0.225

1

15X

16X

0.152

F. DRAWING FILE NAME : UMLP16AREV3

D. TERMINAL SHAPE MAY VARY ACCORDING TO PACKAGE

SUPPLIER, SEE TERMINAL SHAPE VARIANTS

B. DIMENSIONS ARE IN MILLIMETERS.

ANY STANDARDS COMMITTEE

0.40

0.60

0.100

0.30

0.50

0.100

TERMINAL SHAPE VARIANTS

0.15

0.25

15X

PIN 1

NON-PIN 1

0.15

0.25

15X

0.30

0.50

0.15

0.25

0.30

0.50

0.15

0.25

15X

15X

Supplier 1

Supplier 2

PIN 1

NON-PIN 1

E. LAND PATTERN IS A MINIMAL TOE DESIGN