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AD9528BCPZ Datasheet(PDF) 46 Page - Analog Devices |
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AD9528BCPZ Datasheet(HTML) 46 Page - Analog Devices |
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46 / 67 page ![]() AD9528 Data Sheet Rev. D | Page 46 of 67 POWER DISSIPATION AND THERMAL CONSIDERATIONS The AD9528 is a multifunctional, high speed device that targets a wide variety of clock applications. The numerous innovative features contained in the device each consume incremental power. If all outputs are enabled in the maximum frequency and mode that have the highest power, the safe thermal operating conditions of the device may be exceeded. Careful analysis and consideration of power dissipation and thermal management are critical elements in the successful application of the AD9528. The AD9528 is specified to operate within the industrial temperature range of –40°C to +85°C. This specification is conditional, such that the absolute maximum junction temperature is not exceeded (as specified in Table 19). At high operating temperatures, extreme care must be taken when operating the device to avoid exceeding the junction temperature and potentially damaging the device. Many variables contribute to the operating junction temperature within the device, including • Selected driver mode of operation • Output clock speed • Supply voltage • Ambient temperature The combination of these variables determines the junction temperature within the AD9528 for a given set of operating conditions. The AD9528 is specified for an ambient temperature (TA). To ensure that TA is not exceeded, use an airflow source. Use the following equation to determine the junction temperature on the application PCB: TJ = TCASE + (ΨJT × PD) where: TJ is the junction temperature (°C). TCASE is the case temperature (°C) measured at the top center of the package. ΨJT is the value from Table 20. PD is the power dissipation of the AD9528. Values of θJA are provided for package comparison and PCB design considerations. θJA can be used for a first order approximation of TJ by the equation TJ = TA + (θJA × PD) where TA is the ambient temperature (°C). Values of θJC are provided for package comparison and PCB design considerations when an external heat sink is required. Values of ΨJB are provided for package comparison and PCB design considerations. CLOCK SPEED AND DRIVER MODE Clock speed directly and linearly influences the total power dissipation of the device and, therefore, the junction temperature. Two operating frequencies are listed under the incremental power dissipation parameter in Table 3. Using linear interpretation is a sufficient approximation for frequency not listed in the table. When calculating power dissipation for thermal consideration, remove the amount of power dissipated in the 100 Ω resistor. If using the data in Table 3, this power is already removed. If using the current vs. frequency graphs provided in the Typical Performance Characteristics section, the power into the load must be subtracted, using the following equation: PLOAD = Differential Output Voltage Swing2/100 Ω EVALUATION OF OPERATING CONDITIONS The first step in evaluating the operating conditions is to determine the maximum power consumption (PD) internal to the AD9528. The maximum PD excludes power dissipated in the load resistors of the drivers because such power is external to the device. Use the power dissipation specifications listed in Table 3 to calculate the total power dissipated for the desired configuration. Table 34 and Table 35 summarize the incremental power dissipation from the base power configuration for two different examples. Table 34. Temperature Gradient Examples, Example 1 Description Mode Frequency (MHz) Maximum Power (mW) Base Typical Configuration N/A1 N/A1 590 Output Driver 6 × HSTL 122.88 480 Output Driver 3 × LVDS 122.88 210 Output Driver 1 × LVDS 409.6 78 Total Power 1358 1 N/A means not applicable. Table 35. Temperature Gradient Examples, Example 2 Description Mode Frequency (MHz) Maximum Power (mW) Base Typical Configuration N/A1 N/A1 590 Output Driver 13 × HSTL 122.88 1040 Total Power 1630 1 N/A means not applicable. |
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