Data Sheet

HMC8411LP2FE

Rev. A | Page 23 of 23

OUTLINE DIMENSIONS

1.70

1.60

1.50

0.30

0.25

0.20

TOP VIEW

SIDE VIEW

0.35

0.30

0.25

BOTTOM VIEW

PIN 1 INDEX

AREA

0.90

0.85

0.80

1.10

1.00

0.90

0.203 REF

0.05 MAX

0.02 NOM

1.30 REF

0.65

BSC

EXPOSED

PAD

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

2.05

2.00 SQ

1.95

5

8

1

4

COPLANARITY

0.08

SEATING

PLANE

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 73. 6-Lead Lead Frame Chip Scale Package [LFCSP],

2 mm × 2 mm Body and 0.85 mm Package Height

(CP-6-12)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Option

HMC8411LP2FE

−40°C to +85°C

MSL1

6-Lead Lead Frame Chip Scale Package [LFCSP]

CP-6-12

HMC8411LP2FETR

−40°C to +85°C

MSL1

6-Lead Lead Frame Chip Scale Package [LFCSP]

CP-6-12

EV1HMC8411LP2F

Evaluation Board

1

The HMC8411LP2FE and HMC8411LP2FETR are RoHS compliant parts.

2

When ordering the evaluation board only, reference the model number, EV1HMC8411LP2F.

3

See the Absolute Maximum Ratings section for additional information.

4

The lead finish of the HMC8411LP2FE and HMC8411LP2FETR is nickel palladium gold (NiPdAu).

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D15859-0-5/19(A)