4

AMC3301

SBAS917 – AUGUST 2019

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Copyright © 2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

see

(1)

MIN

MAX

UNIT

Power-supply voltage

VDD to GND

–0.3

6.5

V

Analog input voltage

INP, INN

HGND – 6

HLDOout + 0.5

V

Output voltage

OUTP, OUTN

GND – 0.5

VDD + 0.5

V

Input current

Continuous, any pin except power-supply pins

–10

10

mA

Temperature

150

°C

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±1000

(1)

operation. Observe analog input voltage range as specified in the Absolute Maximum Ratings table.

6.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Low-side power supply

VDD to GND

3

3.3

5.5

V

Differential input voltage before clipping output

±320

mV

Specified linear differential full-scale voltage

–250

250

mV

–2

HLDOout

V

Operating common-mode input voltage

–0.16

1

V

Specified ambient temperature

–40

125

°C