5

AMC3301

www.ti.com

SBAS917 – AUGUST 2019

Product Folder Links: AMC3301

Submit Documentation Feedback

Copyright © 2019, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

AMC3301

UNIT

DWL (SOIC)

16 PINS

Junction-to-ambient thermal resistance

73.5

°C/W

Junction-to-case (top) thermal resistance

31

°C/W

Junction-to-board thermal resistance

44

°C/W

Junction-to-top characterization parameter

16.7

°C/W

Junction-to-board characterization parameter

42.8

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Maximum power dissipation

VDD = 5.5 V

170.5

mW

VDD = 3.6 V

108