STM32L4A6XG datasheet(12/282 Pages) STMICROELECTRONICS

12 / 282 page

List of figures

STM32L4A6xG

12/282

DS11584 Rev 8

Figure 48.

Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms . . . . . . . . . . . . . . 233

Figure 49.

Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms . . . . . . . . . . . . . . 235

Figure 50.

Asynchronous multiplexed PSRAM/NOR read waveforms. . . . . . . . . . . . . . . . . . . . . . . . 236

Figure 51.

Asynchronous multiplexed PSRAM/NOR write waveforms . . . . . . . . . . . . . . . . . . . . . . . 238

Figure 52.

Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 240

Figure 53.

Synchronous multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242

Figure 54.

Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . 244

Figure 55.

Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245

Figure 56.

NAND controller waveforms for read access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247

Figure 57.

NAND controller waveforms for write access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247

Figure 58.

NAND controller waveforms for common memory read access . . . . . . . . . . . . . . . . . . . . 247

Figure 59.

NAND controller waveforms for common memory write access. . . . . . . . . . . . . . . . . . . . 248

Figure 60.

DCMI timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 249

Figure 61.

SDIO high-speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250

Figure 62.

SD default mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251

Figure 63.

UFBGA - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid

array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253

Figure 64.

UFBGA - 169-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid

array recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254

Figure 65.

UFBGA169 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255

Figure 66.

UFBGA169, external SMPS device, marking (package top view . . . . . . . . . . . . . . . . . . . 256

Figure 67.

LQFP - 144-pin, 20 x 20 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . . 257

Figure 68.

LQFP - 144-pin,20 x 20 mm low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259

Figure 69.

LQFP144 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260

Figure 70.

LQFP144, external SMPS device, marking (package top view) . . . . . . . . . . . . . . . . . . . . 261

Figure 71.

UFBGA - 132-ball, 7 x 7 mm ultra thin fine pitch ball grid array

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262

Figure 72.

UFBGA - 132-ball, 7 x 7 mm ultra thin fine pitch ball grid array

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263

Figure 73.

UFBGA132 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264

Figure 74.

UFBGA132, external SMPS device, marking (package top view) . . . . . . . . . . . . . . . . . . 264

Figure 75.

LQFP - 100-pin, 14 x 14 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . . 265

Figure 76.

LQFP - 100-pin, 14 x 14 mm low-profile quad flat

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266

Figure 77.

LQFP100 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267

Figure 78.

LQFP100, external SMPS device, marking (package top view) . . . . . . . . . . . . . . . . . . . . 267

Figure 79.

WLCSP – 100 ball, 4.618 x 4.142 mm, 0.4 mm pitch wafer level chip scale

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 268

Figure 80.

WLCSP – 100 ball, 4.166 x 4.628 mm 0.4 mm pitch wafer level chip scale

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 269

Figure 81.

WLCSP100 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270

Figure 82.

WLCSP100, external SMPS device, marking (package top view) . . . . . . . . . . . . . . . . . . 271

Figure 83.

LQFP - 64-pin, 10 x 10 mm low-profile quad flat package outline . . . . . . . . . . . . . . . . . . 272

Figure 84.

LQFP - 64-pin, 10 x 10 mm low-profile quad flat package

recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 273

Figure 85.

LQFP64 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274

Figure 86.

LQFP64, external SMPS device, marking (package top view) . . . . . . . . . . . . . . . . . . . . . 274

STM32L4A6XG Datasheet(PDF) 12 Page - STMicroelectronics

STM32L4A6XG Datasheet(HTML) 12 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL