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STM32H742AI Datasheet(PDF) 327 Page - STMicroelectronics |
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STM32H742AI Datasheet(HTML) 327 Page - STMicroelectronics |
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327 / 357 page ![]() DS12110 Rev 7 327/357 STM32H742xI/G STM32H743xI/G Package information 352 8.2 TFBGA100 package information TFBGA100 is a 100-ball, 8 x 8 mm, 0.8 mm pitch, thin fine-pitch ball grid array package. Figure 123. TFBGA100 package outline 1. Drawing is not to scale. Table 218. TFBGA100 package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A - - 1.100 - - 0.0433 A1 0.150 - - 0.0059 - - A2 - 0.760 - - 0.0299 - b 0.350 0.400 0.450 0.0138 0.0157 0.0177 D 7.850 8.000 8.150 0.3091 0.3150 0.3209 SEATING PLANE 1 2 3 4 5 6 7 8 9 10 K J H G F E D C B A C (100 BALLS) b eee fff CA B C D F e A1 ball identifier A1 ball index area A A08Q_ME_V1 D1 BOTTOM VIEW TOP VIEW |
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