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STM32H742AI Datasheet(PDF) 328 Page - STMicroelectronics |
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STM32H742AI Datasheet(HTML) 328 Page - STMicroelectronics |
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328 / 357 page ![]() Package information STM32H742xI/G STM32H743xI/G 328/357 DS12110 Rev 7 Figure 124. TFBGA100 package recommended footprint 1. Dimensions are expressed in millimeters. D1 - 7.200 - 0.2835 - E 7.850 8.000 8.150 0.3091 0.3150 0.3209 E1 - 7.200 - - 0.2835 - e - 0.800 - - 0.0315 - F - 0.400 - - 0.0157 - G - 0.400 - - 0.0157 - ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 219. TFBGA100 recommended PCB design rules (0.8 mm pitch BGA) Dimension Recommended values Pitch 0.8 Dpad 0.400 mm Dsm 0.470 mm typ (depends on the soldermask registration tolerance) Table 218. TFBGA100 package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max Dpad Dsm |
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