RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

Y2

X2

1.40

1.60

MILLIMETERS

0.50 BSC

MIN

E

MAX

Contact Pad Length (X8)

Contact Pad Width (X8)

Y1

X1

0.85

0.30

NOM

1

2

8

C

Contact Pad Spacing

2.90

Contact Pad to Center Pad (X8)

G1

0.20

Thermal Via Diameter

V

Thermal Via Pitch

EV

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

© 2017 Microchip Technology Inc.

Microchip Technology Drawing C04-21355-Q4B Rev A

8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]

Atmel Legacy YNZ Package

X2

Y2

Y1

SILK SCREEN

X1

E

C

EV

G2

G1

ØV

Contact Pad to Contact Pad (X6)

G2

0.33

ATECC608A

Package Drawings

Datasheet Summary

DS40001977A-page 22