SC16C752 datasheet(45/47 Pages) PHILIPS

45 / 47 page

Philips Semiconductors

SC16C752

Dual UART with 64-byte FIFO

Product data

Rev. 04 — 20 June 2003

45 of 47

9397 750 11635

[3]

These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must

on no account be processed through more than one soldering cycle or subjected to infrared reﬂow

soldering with peak temperature exceeding 217

°C ± 10 °C measured in the atmosphere of the reﬂow

oven. The package body peak temperature must be kept as low as possible.

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom

side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with

the heatsink on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it

is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

14. Revision history

Table 28:

Revision history

Rev Date

CPCN

Description

20030620

Product data (9397 750 11635); ECN 853-2379 30031 of 16 June 2003.

Modiﬁcations:

• Figure 12 “Crystal oscillator connections.” on page 18: capacitors’ values changed and

added connection with resistor.

20030313

Product data (9397 750 11196); ECN 853-2379 29623 of 10 March 2003.

20021216

Product data (9397 750 10811); ECN 853-2379 29261 of 06 December 2002.

20020910

Product data (9397 750 09575); ECN 853-2379 28891 of 10 September 2002.

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