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FPD3000P100 Datasheet(PDF) 1 Page - Filtronic Compound Semiconductors |
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FPD3000P100 Datasheet(HTML) 1 Page - Filtronic Compound Semiconductors |
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1 / 3 page ![]() FPD3000P100 2W PACKAGED POWER PHEMT Phone: +1 408 850-5790 http://www.filtronic.co.uk/semis Released: 6/27/05 Fax: +1 408 850-5766 Email: sales@filcsi.com • FEATURES ♦ 32.5 dBm Linear Output Power ♦ 17 dB Power Gain at 2 GHz ♦ 9.5 dB Maximum Stable Gain at 10 GHz ♦ 42 dBm Output IP3 ♦ 45% Power-Added Efficiency at 2 GHz • DESCRIPTION AND APPLICATIONS The FPD3000P100 is a packaged AlGaAs/InGaAs pseudomorphic High Electron Mobility Transistor (PHEMT), featuring a 0.25 µm by 3000 µm Schottky barrier gate, defined by high- resolution stepper-based photolithography. The recessed and offset Gate structure minimizes parasitics to optimize performance. The epitaxial structure and processing have been optimized for reliable high-power applications. The FPD3000P100 also features Si3N4 passivation and is also available in die form and in the low cost plastic SOT89 plastic package. Typical applications include commercial and other narrowband and broadband high-performance amplifiers, including SATCOM uplink transmitters, PCS/Cellular low-voltage high-efficiency output amplifiers, and medium-haul digital radio transmitters. • ELECTRICAL SPECIFICATIONS AT 22°C Parameter Symbol Test Conditions Min Typ Max Units UNLESS OTHERWISE NOTED, RF SPECIFICATIONS MEASURED AT f = 2 GHz USING CW SIGNAL Power at 1dB Gain Compression P1dB VDS = 8 V; IDS = 50% IDSS 31.0 32.5 dBm Power Gain at P1dB G1dB VDS = 8 V; IDS = 50% IDSS 16.5 17.0 dB Maximum Stable Gain (S21/S12) SSG VDS = 8 V; IDS = 50% IDSS f = 2 GHz f = 10 GHz 20.5 8.5 21.5 9.5 dB dB Power-Added Efficiency PAE VDS = 8 V; IDS = 50% IDSS; POUT = P1dB 45 % Output Third-Order Intercept Point (from 15 to 5 dB below P1dB) IP3 VDS = 8V; IDS = 50% IDSS Matched for optimal power 42 dBm Saturated Drain-Source Current IDSS VDS = 1.3 V; VGS = 0 V 750 930 1110 mA Maximum Drain-Source Current IMAX VDS = 1.3 V; VGS ≅ +1 V 1.5 A Transconductance GM VDS = 1.3 V; VGS = 0 V 800 mS Gate-Source Leakage Current IGSO VGS = -5 V 2 20 µA Pinch-Off Voltage |VP| VDS = 1.3 V; IDS = 3 mA 0.7 1.0 1.3 V Gate-Drain Breakdown Voltage |VBDGD| IGD = 3 mA 14.5 16.0 V Thermal Resistivity (see Notes) θJC VDS > 6V 24 °C/W |
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