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ADRF5043BCCZN-R7 Datasheet(PDF) 5 Page - Analog Devices

Part # ADRF5043BCCZN-R7
Description  Nonreflective, 9 kHz to 44 GHz Silicon SP4T Switch
PDF  12 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADRF5043BCCZN-R7 Datasheet(HTML) 5 Page - Analog Devices

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Data Sheet
ADRF5043
Rev. 0 | Page 5 of 12
ABSOLUTE MAXIMUM RATINGS
For recommended operating conditions, see Table 1.
Table 2.
Parameter
Rating
Supply Voltage
Positive
−0.3 V to +3.6 V
Negative
−3.6 V to +0.3 V
Digital Control Inputs1
−0.3 V to VDD + 0.3 V or 3.3 mA,
whichever occurs first
RFx Input Power (f2 = 1 MHz to
44 GHz, TCASE = 85°C3)
Through Path
Average
26 dBm
Peak
26dBm
Terminated Path
Average
25 dBm
Peak
25dBm
Hot Switching
Average
25 dBm
Peak
25dBm
Temperature
Junction, TJ
135°C
Storage Range
−65°C to +150°C
Reflow
260°C
1
Overvoltages at digital control inputs are clamped by internal diodes.
Current must be limited to the maximum rating given.
2
For power derating over frequency, see Figure 2.
3
For 105°C operation, the power handling degrades from the TCASE = 85°C
specification by 3 dB.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θJC is the junction to case bottom (channel to package bottom)
thermal resistance.
Table 3. Thermal Resistance
Package Type
θJC1
Unit
CC-24-12
Through Path
468
°C/W
Terminated Path
200
°C/W
1
θJC was determined by simulation under the following conditions: the heat
transfer is due solely to thermal conduction from the channel through the
ground pad to the PCB, and the ground pad is held constant at the
operating temperature of 85°C.
ELECTROSTATIC DISCHARGE (ESD) RATINGS
The following ESD information is provided for handling of ESD
sensitive devices in an ESD protected area only.
Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.
ESD Ratings for ADRF5043
Table 4. ADRF5043, 24-Terminal LGA
ESD Model
Withstand Threshold (V)
HBM
RFx Pins
1000
Supply and Digital Control Pins
2000
POWER DERATING CURVES
2
–18
–16
–14
10k
100G
FREQUENCY (Hz)
–12
–10
–8
–6
–4
–2
0
100k
1M
10M
100M
1G
10G
Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C
ESD CAUTION



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