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TPS70950DBVT Datasheet(PDF) 17 Page - Texas Instruments |
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TPS70950DBVT Datasheet(HTML) 17 Page - Texas Instruments |
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17 / 39 page ![]() COUT VOUT VIN GND PLANE CIN Represents via used for application specific connections 1 2 3 4 5 TPS709 www.ti.com SBVS186G – MARCH 2012 – REVISED NOVEMBER 2015 10 Layout 10.1 Layout Guidelines Place input and output capacitors as close to the device pins as possible. To improve ac performance (such as PSRR, output noise, and transient response), TI recommends that the board be designed with separate ground planes for VIN and VOUT, with the ground plane connected only at the GND pin of the device. In addition, the ground connection for the output capacitor must be connected directly to the device GND pin. 10.1.1 Thermal Protection Thermal protection disables the output when the junction temperature rises to approximately 165°C, allowing the device to cool. When the junction temperature cools to approximately 145°C, the output circuitry is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit can cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a result of overheating. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. For reliable operation, limit junction temperature to 125°C, maximum. To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection must trigger at least 35°C above the maximum expected ambient condition of the particular application. This configuration produces a worst-case junction temperature of 125°C at the highest expected ambient temperature and worst-case load. The TPS709 internal protection circuitry is designed to protect against overload conditions. This circuitry is not intended to replace proper heatsinking. Continuously running the TPS709 into thermal shutdown degrades device reliability. 10.2 Layout Example Figure 39. Layout Example for DBV Package Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 17 Product Folder Links: TPS709 |
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