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STM32WB5MMG Datasheet(PDF) 19 Page - STMicroelectronics |
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STM32WB5MMG Datasheet(HTML) 19 Page - STMicroelectronics |
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19 / 31 page ![]() 9 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 9.1 SiP-LGA86 package information This SiP-LGA is a 86 pin, 7.3 x 11mm, system in package land grid array package. Figure 12. SiP-LGA86 - Outline bbb C B A aaa (4x) SIDE VIEW BOTTOM VIEW A A1 DETAIL A SPsw D2 S M SPts PIN A1 CORNER E D3 E eE D D1 eD G2 G1 F1 F2 F3 F3 F4 G4 (x2)b1xb1 G3 A1 CORNER (x56)b2xb3 (x24)b4xb4 F2 (x4)b2xb2 TOP VIEW H1 H2 A2 DETAIL A E1 1. Drawing is not to scale. STM32WB5MMG Package information DS13252 - Rev 1 page 19/31 |
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