www.ti.com

ABSOLUTE MAXIMUM RATINGS

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Top View

1

2

3

5

4

Out

−V

CC

V

REF

+V

CC

In

AWO

Pin Orientation/Package Marking

SOT23−5

x1

x1

200

Ω

50k

Ω

50k

Ω

1

2

3

4

8

7

6

5

+V

CC

NC

NC

In

Out

NC

V

REF

−V

CC

SO−8

NC = No Connection

x1

x1

200

Ω

50k

Ω

50k

Ω

BUF602

SBOS339 – OCTOBER 2005

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated

circuits be handled with appropriate precautions. Failure to observe proper handling and installation

procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision

integrated circuits may be more susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT MEDIA,

PRODUCT

PACKAGE

DESIGNATOR

RANGE

MARKING

NUMBER

QUANTITY

BUF602ID

Rails, 75

BUF602

SO-8

D

–45

°C to +85°C

BUF602

BUF602IDR

Tape and Reel, 2500

BUF602IDBVT

Tape and Reel, 250

BUF602

SOT23-5

DBV

–45

°C to +85°C

AWO

BUF602IDBVR

Tape and Reel, 3000

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For the most current package and ordering information, see the Package Option Addendum at the end of this document or see the TI

web site at www.ti.com.

Power Supply

±6.5V

DC

Internal Power Dissipation

See Thermal Information

Input Common-Mode Voltage Range

±V

S

Storage Temperature Range: D, DBV

–40

°C to +125°C

Lead Temperature (soldering, 10s)

+300

°C

+150

°C

ESD Rating:

Human Body Model (HBM)

2000V

Charge Device Model (CDM)

1000V

Machine Model (MM)

200V

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Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

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