TLV9102IDDFR datasheet(2/74 Pages) TI

2 / 74 page

TLV9101, TLV9102, TLV9104

SBOS943C – FEBRUARY 2019 – REVISED MAY 2020

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Product Folder Links: TLV9101 TLV9102 TLV9104

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Table of Contents

Features .................................................................. 1

Applications ........................................................... 1

Description ............................................................. 1

Revision History..................................................... 2

Pin Configuration and Functions ......................... 3

Specifications......................................................... 9

6.1

Absolute Maximum Ratings ...................................... 9

6.2

ESD Ratings.............................................................. 9

6.3

Recommended Operating Conditions ....................... 9

6.4

Thermal Information for Single Channel ................... 9

6.5

Thermal Information for Dual Channel.................... 10

6.6

Thermal Information for Quad Channel .................. 10

6.7

Electrical Characteristics......................................... 11

6.8

Typical Characteristics ............................................ 14

Detailed Description ............................................ 22

7.1

Overview ................................................................. 22

7.2

Functional Block Diagram ....................................... 22

7.3

Feature Description................................................. 23

7.4

Device Functional Modes........................................ 30

Application and Implementation ........................ 31

8.1

Application Information............................................ 31

8.2

Typical Applications ................................................ 31

Power Supply Recommendations ...................... 33

Layout................................................................... 33

10.1

Layout Guidelines ................................................. 33

10.2

Layout Example .................................................... 33

Device and Documentation Support ................. 36

11.1

Device Support...................................................... 36

11.2

Documentation Support ........................................ 36

11.3

Related Links ........................................................ 36

11.4

Receiving Notification of Documentation Updates 36

11.5

Support Resources ............................................... 37

11.6

Trademarks ........................................................... 37

11.7

Electrostatic Discharge Caution ............................ 37

11.8

Glossary ................................................................ 37

Mechanical, Packaging, and Orderable

Information ........................................................... 38

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (January 2020) to Revision C

Page

•

Removed preview notation from TLV9102 VSSOP (10) package from Device Information table ......................................... 1

•

Removed preview notation from TLV9102 X2QFN (10) package from Device Information table.......................................... 1

•

Removed preview notation from TLV9102 DGS package (VSSOP) in the Pin Configuration and Functions section........... 5

•

Removed preview notation from TLV9102 RUG package (X2QFN) in the Pin Configuration and Functions section ........... 5

Changes from Revision A (April 2019) to Revision B

Page

•

Changed the TLV9101 and TLV9104 device statuses from Advance Information to Production Data ................................. 1

•

Removed preview notation from TLV9101 SOT-23 (5) package from Device Information table ........................................... 1

•

Removed preview notation from TLV9101 SOT-23 (6) package from Device Information table ........................................... 1

•

Removed preview notation from TLV9101 SC70 (5) package from Device Information table............................................... 1

•

Removed preview notation from TLV9102 TSSOP (8) package from Device Information table ........................................... 1

•

Removed preview notation from TLV9102 WSON (8) package from Device Information table ............................................ 1

•

Removed preview notation from TLV9104 SOIC (14) package from Device Information table............................................. 1

•

Removed preview notation from TLV9104 TSSOP(14) package from Device Information table .......................................... 1

•

Removed preview notation from TLV9102 DSG package (WSON) in the Pin Configuration and Functions section ............ 4

•

Added SHUTDOWN to Electrical Characteristics................................................................................................................. 12

•

Added Packages With an Exposed Thermal Pad to the Feature Description...................................................................... 29

Changes from Original (February 2019) to Revision A

Page

•

Changed the TLV9102 device status from Advance Information to Production Data ............................................................ 1

•

Removed preview notation from TLV9102 SOIC (8) package from Device Information table............................................... 1

TLV9102IDDFR Datasheet(PDF) 2 Page - Texas Instruments

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