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F159V Datasheet(PDF) 21 Page - Renesas Technology Corp |
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F159V Datasheet(HTML) 21 Page - Renesas Technology Corp |
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21 / 78 page ![]() © 2020 Renesas Electronics Corporation 21 May 15, 2020 F159V Datasheet 6. Thermal Characteristics Table 17. Package Thermal Characteristics Parameter Symbol Value Units Junction to Ambient Thermal Resistance θJA 32 °C/W Junction to Case Thermal Resistance. (Case is defined as the exposed paddle) θJC-BOT 3 °C/W Moisture Sensitivity Rating (Per J-STD-020) MSL 3 7. Typical Operating Conditions (TOC) Unless otherwise noted, for the TOC graphs on the following pages, the following conditions apply: Baseband I and Q levels = -20dBm each tone (~ 100mVp-p differential/channel/tone across 110Ω) Baseband I and Q tones = 49MHz, 50MHz Maximum Gain Setting Use internal LO with LO_SW_OUT for +4dBm setting TEP = +25°C VDD = +3.3V VCM = +0.325V Internal fLO = 2050MHz OIP2 Measured at fLO + (fBB1 ± fBB2) Enable pins = GND EVKit RF output trace and connector losses de-embedded |
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