F2977 Datasheet

© 2017 Integrated Device Technology, Inc.

2

Rev O May 19, 2017

Pin Assignments

Figure 2.

Pin Assignments for 2mm x 2mm x 0.5mm 12-pin VFQFP-N, NEG12 – Top View

EN

GND

RF2

GND

RF1

GND

F2977

GND

RFC

GND

GND

EP

Pin Descriptions

Table 1.

Pin Descriptions

Number

Name

Description

1

GND

Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.

2

RFC

RF Common Port. If this pin is not 0V DC, then an external coupling capacitor must be used.

3

GND

Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.

4

GND

Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.

5

RF1

RF1 Port. If this pin is not 0V DC, then an external coupling capacitor must be used.

6

GND

Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.

7

Logic control pin.

8

EN

Active HIGH enable pin. If LOW, neither RF1 nor RF2 are connected to RFC. Pin is internally pulled up to

2.5V through a 500k resistor.

9

Power supply. Bypass to GND with capacitors shown in the Typical Application Circuit as close as

possible to pin.

10

GND

Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.

11

RF2

RF2 Port. If this pin is not 0V DC, then an external coupling capacitor must be used.

12

GND

Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.

EP

Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple

ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground

vias are also required to achieve the specified RF performance.