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MCP47FVB28T-MQ Datasheet(PDF) 94 Page - Microchip Technology |
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MCP47FVB28T-MQ Datasheet(HTML) 94 Page - Microchip Technology |
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94 / 124 page ![]() MCP47FXBX4/8 DS20006368A-page 94 2020 Microchip Technology Inc. The second Start bit is sent to address the rare possibility of an erroneous write. This could occur if the master device was reset while sending a WRITE com- mand to the MCP47FXBX4/8, and then as the master device returns to normal operation and issues a Start condition, while the MCP47FXBX4/8 devices issue an acknowledge. In this case, if the second Start bit is not sent (and the Stop bit was sent) the MCP47FXBX4/8 could initiate a write cycle. The Stop bit terminates the current I2C bus activity. The MCP47FXBX4/8 waits to detect the next Start condition. This sequence does not affect any other I2C devices which may be on the bus, as they should disregard this for being an invalid command. 8.2 Power Supply Considerations The power source should be as clean as possible. The power supply to the device is also used for the DAC voltage reference internally if the internal VDD is selected as the resistor ladder’s reference voltage (VRnB:VRnA = ‘00’). Any noise induced on the VDD line can affect the DAC performance. Typical applications will require a bypass capacitor in order to filter out high-frequency noise on the VDD line. The noise can be induced onto the power supply’s traces or as a result of changes on the DAC out- put. The bypass capacitor helps to minimize the effect of these noise sources on signal integrity. Figure 8-3 shows an example of using two bypass capacitors (a 10 µF tantalum capacitor and a 0.1 µF ceramic capaci- tor) in parallel on the VDD line. These capacitors should be placed as close to the VDD pin as possible (within 4 mm). If the application circuit has separate digital and analog power supplies, the VDD and VSS pins of the device should reside on the analog plane. When setting the part voltage reference to Band Gap mode, the use of the VREF pin decoupling capacitors is not recommended. FIGURE 8-3: Circuit Example. Note: The potential for this erroneous write ONLY occurs if the master device is reset while sending a WRITE command to the MCP47FEBXX. Analog VDD VDD SDA SCL VSS VOUT0 R1 R2 To MCU R1 and R2 are I2C pull-up resistors: R1 and R2: = 5k - 10 k for fSCL = 100 kHz to 400 kHz ~700 for fSCL = 3.4 MHz C1: 0.1 µF capacitor = Ceramic C2: 10 µF capacitor = Tantalum C3: ~ 0.1 µF = Optional to reduce noise in VOUT pin C4: 0.1 µF capacitor = Ceramic C5: 10 µF capacitor = Tantalum C6: 0.1 µF capacitor = Ceramic C2 C1 Optional (a) Circuit when VDD is selected as reference. (Note: VDD is connected to the reference circuit internally.) (b) Circuit when external reference is used. Output VREF LAT/HVC VOUTN CN C3 Analog VDD VDD SDA SCL To MCU C2 C1 VREF VREF R1 R2 Analog VSS VOUT0 Optional Output LAT/HVC VOUTN CN C3 |
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