FSB50825B datasheet(2/14 Pages) ONSEMI

2 / 14 page

FSB50825B/FSB50825BS

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ABSOLUTE MAXIMUM RATINGS (TC = 25°C, Unless otherwise noted)

Symbol

Parameter

Conditions

Rating

Unit

VPN

DC Link Input Voltage,

Drain−Source Voltage of Each MOSFET

250

BVDSS

Drain−Source Voltage

VIN = 0V, ID = 250 mA

250

IPN

Zero−Bias Static Leakage Current

VPN= 200V, VIN = 0V,

VDD= VBS= 0V,

TC= TJ = 25°C for all phase

ID 25 (Note 2)

Each MOSFET Drain Current, Continuous

TC = 25°C

3.6

ID 80 (Note 2)

Each MOSFET Drain Current, Continuous

TC = 80°C

2.7

IDP (Note 2)

Each MOSFET Drain Current, Peak

TC = 25°C, PW < 100 ms

9.0

IDRMS (Note 2) Each FRFET Drain Current, Rms

TC = 80°C, FPWM < 20 kHz

1.9

Arms

PD (Note 2)

Maximum Power Dissipation

TC = 25°C, For Each MOSFET

14.2

CONTROL PART (Each HVIC Unless Otherwise Specified)

Symbol

Parameter

Conditions

Rating

Unit

VDD

Control Supply Voltage

Applied Between VDD and COM

VBS

High−side Bias Voltage

Applied Between VB and VS

VIN

Input Signal Voltage

Applied Between IN and COM

−0.3 ~ VDD+0.3

BOOTSTRAP DIODE PART (Each Bootstrap Diode Unless Otherwise Specified)

Symbol

Parameter

Conditions

Rating

Unit

VRRMB

Maximum Repetitive Reverse Voltage

250

IFB (Note 2)

Forward Current

TC = 25°C

0.5

IFPB (Note 2)

Forward Current (Peak)

TC = 25°C, Under 1ms Pulse Width

1.5

THERMAL RESISTANCE

Symbol

Parameter

Conditions

Rating

Unit

Inverter MOSFET part, (Per Module)

1.7

_C/W

TOTAL SYSTEM

Symbol

Parameter

Conditions

Rating

Unit

Operating Junction Temperature

−40 ~ 150

TSTG

Storage Temperature

−40 ~ 125

VISO

Isolation Voltage

60 Hz, Sinusoidal, 1 minute, Connec-

tion Pins to Heatsink

1500

Vrms

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. For the Measurement Point of Case Temperature TC, Please refer to Figure 5.

2. Calculation Value or Design Factor.

3. Using continuously under heavy loads or excessive assembly conditions (e.g. the application of high temperature/ current/ voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.

operating temperature/ current/ voltage, etc.) are within the absolute maximum ratings and the operating ranges.

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