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MIC7300 Datasheet(PDF) 11 Page - Microchip Technology

Part # MIC7300
Description  High-Output Drive Rail-to-Rail Op Amp
PDF  22 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MIC7300 Datasheet(HTML) 11 Page - Microchip Technology

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 2020 Microchip Technology Inc.
DS20006305A-page 11
MIC7300
4.0
APPLICATION INFORMATION
4.1
Input Common-Mode Voltage
The MIC7300 tolerates input overdrive by at least
300 mV beyond either rail without producing phase
inversion.
If the absolute maximum input voltage is exceeded, the
input current should be limited to ±5 mA maximum to
prevent reducing reliability. A 10 kΩ series input
resistor, used as a current limiter, will protect the input
structure from voltages as large as 50V above the
supply or below ground. See Figure 4-1.
VIN
VOUT
10k
RIN
FIGURE 4-1:
Input Current-Limit
Protection.
4.2
Output Voltage Swing
Sink and source output resistances of the MIC7300 are
equal. Maximum output voltage swing is determined by
the load and the approximate output resistance. The
output resistance is shown in Equation 4-1.
EQUATION 4-1:
ROUT
V DROP
I LOAD
------------------
=
VDROP is the voltage dropped within the amplifier
output stage. VDROP and ILOAD can be determined from
the VO (output swing) portion of the appropriate
Electrical Characteristics table. ILOAD is equal to the
typical output high voltage minus V+/2 and divided by
RLOAD. For example, using the 5V table, the typical
output high voltage using a 2 kΩ load (connected to
V+/2) is 4.985V, which produces an ILOAD of:
EQUATION 4-2:
4.985V
2.5V
–
2k
------------------------------------


1.243mA
=
Voltage drop in the amplifier output stage is:
EQUATION 4-3:
V DROP
5.0V
4.985V
–
0.015V
==
Because of output stage symmetry, the corresponding
typical output low voltage (0.015V) also equals VDROP.
Then:
EQUATION 4-4:
ROUT
0.015V
0.001243A
--------------------------
12
==
4.3
Power Dissipation
The MIC7300 output drive capability requires
considering power dissipation. If the load impedance is
low, it is possible to damage the device by exceeding
the maximum junction temperature rating.
On-chip power consists of two components: supply
power and output stage power. Supply power (PS) is
the product of he supply voltage (VS = VV+ – VV–) and
supply current (IS).
Output stage power (PO) is the product of the output
stage voltage drop (VDROP) and the output (load)
current (IOUT). Total on-chip power dissipation is:
EQUATION 4-5:
PD
PS PO
+
=
Where:
PD = Total on-chip power
PS = Supply power dissipation
PO = Output power dissipation
EQUATION 4-6:
PD
V SIS V DROPIOUT
+
=
Where:
VS = VV+ – VV–
IS = Power supply current
VDROP = VV+ – VOUT (sourcing current)
VDROP = VOUT – VV– (sinking current)
Equation 4-5 and 4-6 address only steady state (DC)
conditions. For non-DC conditions the user must
estimate power dissipation based on the RMS value of
the signal.
The task is one of determining the allowable on-chip
power dissipation for operation at a given ambient
temperature and power supply voltage. From this



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