ADC3641 datasheet(75/77 Pages) TI

Part #	ADC3641

Description	ADC364x 14-bit, 10-MSPS to 65-MSPS, Low-Noise, Low Power Dual Channel ADC

PDF	77 Pages

Scroll/Zoom	100%

Manufacturer	TI [Texas Instruments]

Direct Link	http://www.ti.com

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75 / 77 page

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EXAMPLE BOARD LAYOUT

0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

40X (0.2)

40X (0.6)

(

0.2) TYP

VIA

36X (0.4)

(4.8)

(1.325)

(

3.15)

(R0.05)

TYP

(1.325)

WQFN - 0.8 mm max height

RSB0040E

PLASTIC QUAD FLATPACK - NO LEAD

4219096/A 11/2017

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

EXPOSED

METAL

ADC3641 Datasheet(PDF) 75 Page - Texas Instruments

ADC3641 Datasheet(HTML) 75 Page - Texas Instruments

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