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DAC53508 Datasheet(PDF) 4 Page - Texas Instruments |
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DAC53508 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 38 page ![]() 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VDD Power-supply voltage to AGND –0.3 6 V VREFIN External reference voltage to AGND –0.3 VDD + 0.3 V Digital input(s) to AGND –0.3 VDD + 0.3 V VOUT Voltage output to AGND –0.3 VDD + 0.3 V Current into any pin –10 10 mA TJ Junction temperature,TJ –40 150 °C Tstg Storage temperature, Tstg –65 150 °C (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±1000 V Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD to AGND Positive supply voltage to ground 1.8 5.5 V VREFIN to AGND Reference input supply voltage to ground 1.8 VDD V VIH Digital input high voltage, 1.8 V ≤ VDD ≤ 2.7 V VDD – 0.3 V Digital input high voltage, 2.7 V < VDD ≤ 5.5 V 2.4 VIL Digital input low voltage 0.5 V TA Ambient temperature –40 125 °C 7.4 Thermal Information THERMAL METRIC(1) DACx3508 UNIT RTE (WQFN) 16 PIN RθJA Junction-to-ambient thermal resistance 49 °C/W RθJC(top) Junction-to-case (top) thermal resistance 50 °C/W RθJB Junction-to-board thermal resistance 24.1 °C/W ΨJT Junction-to-top characterization parameter 1.1 °C/W YJB Junction-to-board characterization parameter 24.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 8.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. DAC53508, DAC43508 SLASF08 – DECEMBER 2021 www.ti.com 4 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: DAC53508 DAC43508 |
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